Liaoning, China
Business Type:
Manufacturer/Factory & Trading Company
Number of Employees:
454
Year of Establishment:
2000-03-30
Management System Certification:
ISO 9001
Average Lead Time:
Peak season lead time: one month
Off season lead time: one month
OEM/ODM Service
Sample Available
Korean Speaker

Dicing Saw Machine, Dicing Machine, Wafer Incision Machine manufacturer / supplier in China, offering ZSH626 High Precision Dicing Saw for Semiconductor Wafer Cutting, Xmtai Series Intelligent Display Adjusting Instrument, Xmtai Series Intelligent Display Indicator and so on.

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Supplier Homepage Products Dicing Saw Machine ZSH626 High Precision Dicing Saw for Semiconductor Wafer Cutting
  • ZSH626 High Precision Dicing Saw for Semiconductor Wafer Cutting
  • ZSH626 High Precision Dicing Saw for Semiconductor Wafer Cutting

ZSH626 High Precision Dicing Saw for Semiconductor Wafer Cutting

Get Latest Price
Min. Order / Reference FOB Price
1 Piece US $30,000-32,000/ Piece
Port: Shenyang, China
Production Capacity: 800 Set / Year
Payment Terms: L/C, T/T
Saw Type: Circular Saw
Application: Metal Saw
Brand: Hb
Type: Fixed
Power Source: Electricity
Customized: Customized

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Basic Info

Model NO.: ZSH626
Condition: New
Revolving Speed: 40000 Rpm
Accuracy: 0.003mm
Trademark: HB
Transport Package: Wooden Case
Specification: ISO9001
Origin: China
HS Code: 8479899990

Product Description

 
This ZSH626 Dicing Saw Machine is the upgrade model to replace the ZSH506. It has all advantages of ZSH506 model, also has the features of compact structure and higher level of configuration. These machines could widely applicated for dicing materials of Application field: Semiconductor chip, LED, IC, NTC, PCB, quartz and sapphire, photovoltaic wafer, lithium niobate, ceramic, gallium arsenide, glass, etc.
 
The additional functions allowing this ZSH626 to dicing material structures as quadrilateral, hexagon, polygon with varies depth and division, customization is also available.
 
 ZSH626 High Precision Dicing Saw for Semiconductor Wafer Cutting

 
 
 
Specification
Work size Φ6" or6" square
Dicing depth Max.4mm or customization
X-axisDriveServo motor
StrokeMax240mm
Feed rate0.1 - 200mm/s
Y-axisDriveStepper motor & raster
StrokeMax170mm
Y axis resolution0.0005mm
Accuracy<0.003mm/5mm
Z-axisDriveStepper motor
Stroke30mm
Resolution rate0.001mm
Repeat accuracy±0.001mm
θ-axisDrivedirect drive motor
Rotation range380°
resolution ratio1.8″
SpindlePower1.5kw
Speed3000~40000rph
PanelOSWindows
Operation interfaceEnglish, touch-screen
Microscope magnification40× Auto
Microscope light-sourceLED
Machine parametersPower supplysingle phase 220ACV;3kw
Compressed airpressure 0.55MPa, flow 200L/min
Cutting waterpressure 0.2~0.4MPa, flow 3L/min
Spindel cooling waterpressure 0.2~0.4MPa, flow 1.5L/min
 Dimension W*D*H675mm×885mm×1660mm
 Weight450KG
 
 

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