This ZSH626 Dicing Saw Machine is the upgrade model to replace the ZSH506. It has all advantages of ZSH506 model, also has the features of compact structure and higher level of configuration. These machines could widely applicated for dicing materials of Application field: Semiconductor chip, LED, IC, NTC, PCB, quartz and sapphire, photovoltaic wafer, lithium niobate, ceramic, gallium arsenide, glass, etc.
The additional functions allowing this ZSH626 to dicing material structures as quadrilateral, hexagon, polygon with varies depth and division, customization is also available.
|Work size|| ||Φ6" or6" square|
|Dicing depth|| ||Max.4mm or customization|
|Feed rate||0.1 - 200mm/s|
|Y-axis||Drive||Stepper motor & raster|
|Y axis resolution||0.0005mm|
|θ-axis||Drive||direct drive motor|
|Operation interface||English, touch-screen|
|Microscope magnification||40× Auto|
|Machine parameters||Power supply||single phase 220ACV;3kw|
|Compressed air||pressure 0.55MPa, flow 200L/min|
|Cutting water||pressure 0.2~0.4MPa, flow 3L/min|
|Spindel cooling water||pressure 0.2~0.4MPa, flow 1.5L/min|
| ||Dimension W*D*H||675mm×885mm×1660mm|