To apply for round, QFN, glass and ceramic cutting after cleaning. Through high pressure water spray micro flow or a chip at the back of the two fluid will cut clean.
Two kinds of high pressure water and the fluid cleaning solution, two cleaning methods can be combined to separate or choice.
Humanized color touch screen operation interface.
Applicable to the blue film, UV film, PRT substrate film and double membrane
Different, can according to customer's process to different program control.
|Apply the wafer size||3 ~ 8 inches|
|High pressure cleaning pump pressure||2.0~8.5 Mpa|
|Pure water pressure||0.2~0.35 Mpa|
|The nitrogen pressure||0.3~0.5 Mpa|
|The compressed air||0.5~0.8 Mpa|
|The spindle speed range||400~3000 rpm|
|Wash and dry time range||Can be set respectively 3 ~ 3000 seconds|
|display||7 inch color touch screen|
|The machine size||530 (W) x900 (D) (H) x 1250 mm (excluding signal tower height)|
|The power supply||AC 220 50~60Hz|